Standard

IEC 60191-6-19:2010

Feb 2010 Published

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Language English/French

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Abstract

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Document information

Standard from IEC
Published: 25 February 2010
Edition: 1
Document type: IS
ISBN: 9782889100668

Publisher IEC
Distributor IEC
ICS 31.080.01
ISO TC TC 47/SC 47D

Product Relations

Replaces: IEC PAS 60191-6-19:2008

Product life cycle

Previous product

Replaced

IEC PAS 60191-6-19:2008
Current product

Published

IEC 60191-6-19:2010

IEC 60191-6-19:2010

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