Standard

IEC 60191-6-19:2010

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Abstract

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Document information

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Publisher IEC
  • Distributor IEC
  • ICS 31.080.01
  • ISO TC TC 47/SC 47D

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