Standard

IEC 60191-6-2:2001

Dec 2001 Published

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Abstract

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Document information

Standard from IEC
Published: 11 December 2001
Edition: 1
Document type: IS
ISBN: 2831860873

Publisher IEC
Distributor IEC
ICS 31.080.01
ISO TC TC 47/SC 47D

IEC 60191-6-2:2001

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IEC 60191-6-2:2001/COR1:2002

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